Use of Multicomponent Phase Diagrams for Predicting Phase Evoution in Solder/Conductor Systems

K. Zeng, J. Kivilahti

    Research output: Contribution to journalArticleScientificpeer-review

    Original languageEnglish
    Pages (from-to)35-44
    JournalJournal of Electronic Materials
    Volume30
    Issue number1
    Publication statusPublished - 2001
    MoE publication typeA1 Journal article-refereed

    Keywords

    • interconnection
    • interfacial reaction
    • phase formation
    • soldering
    • thermodynamics

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