USE OF INDENTATION TECHNIQUES IN EVALUATING MECHANICAL PROPERTIES OF THIN FILM METALLIZATIONS

Simo Pekka Hannula*, Donald Stone, Che Yu Li

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

3 Citations (Scopus)

Abstract

Recent developments in indentation testing are discussed, the emphasis being on the methods utilizing continuous depth and load recording. Factors affecting the behavior of materials in such experiments are summarized and examples are shown on the use of different semiempirical indices for characterizing the properties of thin surface layers. The potential of indentation testing for determining stress-strain and stress-strain rate relations is reviewed and the deduction of thin film relaxation properties from measurements of combined film and substrate properties is discussed.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherIEEE
Pages424-431
Number of pages8
Publication statusPublished - 1985
MoE publication typeA4 Article in a conference publication
EventElectronic Components and Technology Conference - Washington, United States
Duration: 1 Jan 19851 Jan 1985
Conference number: 35

Publication series

NameProceedings - Electronic Components and Technology Conference
PublisherIEEE
ISSN (Print)0569-5503

Conference

ConferenceElectronic Components and Technology Conference
Country/TerritoryUnited States
CityWashington
Period01/01/198501/01/1985

Fingerprint

Dive into the research topics of 'USE OF INDENTATION TECHNIQUES IN EVALUATING MECHANICAL PROPERTIES OF THIN FILM METALLIZATIONS'. Together they form a unique fingerprint.

Cite this