USE OF INDENTATION TECHNIQUES FOR CHARACTERIZING WIRE BONDING MATERIALS

Donald Stone; S. Ruoff; W. LaFontaine; H. Wilson; Simo-Pekka Hannula; Che Yu Li

USE OF INDENTATION TECHNIQUES FOR CHARACTERIZING WIRE BONDING MATERIALS

Donald Stone
, S. Ruoff
, W. LaFontaine
, H. Wilson
, Simo-Pekka Hannula
, Che Yu Li

Not published at Aalto University

Cornell University

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Abstract

The determination of the mechanical properties of 25- mu m gold bonding wires based on low-load hardness measurements is reported. The experimental techniques are discussed. Measurements of yield strength made with Vickers and Berkovitch indenters were obtained that compared well with those reported from tensile tests on the same wires. Balls produced by electric arc at the ends of wires were found to have lower hardness than the as-received wires. Indentation load relaxation data taken from the balls are reported. The load relaxation data yield information on the flow stress of the material as a function of strain rate.

Original language	English
Title of host publication	Proceedings - Electronic Components and Technology Conference
Publisher	IEEE
Pages	318-323
Number of pages	6
Publication status	Published - 1986
MoE publication type	A4 Conference publication
Event	Electronic Components and Technology Conference - Seattle, WA, United States Duration: 1 Jan 1986 → 1 Jan 1986 Conference number: 36

Publication series

Name	Proceedings - Electronic Components and Technology Conference
Publisher	IEEE
ISSN (Print)	0569-5503

Conference

Conference	Electronic Components and Technology Conference
Country/Territory	United States
City	Seattle, WA
Period	01/01/1986 → 01/01/1986

Cite this

@inproceedings{92ef35b5864d465c800a1daade4810d8,

title = "USE OF INDENTATION TECHNIQUES FOR CHARACTERIZING WIRE BONDING MATERIALS",

abstract = "The determination of the mechanical properties of 25- mu m gold bonding wires based on low-load hardness measurements is reported. The experimental techniques are discussed. Measurements of yield strength made with Vickers and Berkovitch indenters were obtained that compared well with those reported from tensile tests on the same wires. Balls produced by electric arc at the ends of wires were found to have lower hardness than the as-received wires. Indentation load relaxation data taken from the balls are reported. The load relaxation data yield information on the flow stress of the material as a function of strain rate.",

author = "Donald Stone and S. Ruoff and W. LaFontaine and H. Wilson and Simo-Pekka Hannula and Li, \{Che Yu\}",

year = "1986",

language = "English",

series = "Proceedings - Electronic Components and Technology Conference",

publisher = "IEEE",

pages = "318--323",

booktitle = "Proceedings - Electronic Components and Technology Conference",

address = "United States",

note = "Electronic Components and Technology Conference ; Conference date: 01-01-1986 Through 01-01-1986",

}

Stone, D, Ruoff, S, LaFontaine, W, Wilson, H, Hannula, S-P & Li, CY 1986, USE OF INDENTATION TECHNIQUES FOR CHARACTERIZING WIRE BONDING MATERIALS. in Proceedings - Electronic Components and Technology Conference. Proceedings - Electronic Components and Technology Conference, IEEE, pp. 318-323, Electronic Components and Technology Conference, Seattle, WA, United States, 01/01/1986.

USE OF INDENTATION TECHNIQUES FOR CHARACTERIZING WIRE BONDING MATERIALS. / Stone, Donald; Ruoff, S.; LaFontaine, W. et al.
Proceedings - Electronic Components and Technology Conference. IEEE, 1986. p. 318-323 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - USE OF INDENTATION TECHNIQUES FOR CHARACTERIZING WIRE BONDING MATERIALS

AU - Stone, Donald

AU - Ruoff, S.

AU - LaFontaine, W.

AU - Wilson, H.

AU - Hannula, Simo-Pekka

AU - Li, Che Yu

N1 - Conference code: 36

PY - 1986

Y1 - 1986

N2 - The determination of the mechanical properties of 25- mu m gold bonding wires based on low-load hardness measurements is reported. The experimental techniques are discussed. Measurements of yield strength made with Vickers and Berkovitch indenters were obtained that compared well with those reported from tensile tests on the same wires. Balls produced by electric arc at the ends of wires were found to have lower hardness than the as-received wires. Indentation load relaxation data taken from the balls are reported. The load relaxation data yield information on the flow stress of the material as a function of strain rate.

AB - The determination of the mechanical properties of 25- mu m gold bonding wires based on low-load hardness measurements is reported. The experimental techniques are discussed. Measurements of yield strength made with Vickers and Berkovitch indenters were obtained that compared well with those reported from tensile tests on the same wires. Balls produced by electric arc at the ends of wires were found to have lower hardness than the as-received wires. Indentation load relaxation data taken from the balls are reported. The load relaxation data yield information on the flow stress of the material as a function of strain rate.

UR - https://www.scopus.com/pages/publications/0022614668

M3 - Conference article in proceedings

T3 - Proceedings - Electronic Components and Technology Conference

SP - 318

EP - 323

BT - Proceedings - Electronic Components and Technology Conference

PB - IEEE

T2 - Electronic Components and Technology Conference

Y2 - 1 January 1986 through 1 January 1986

ER -

USE OF INDENTATION TECHNIQUES FOR CHARACTERIZING WIRE BONDING MATERIALS

Abstract

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Conference

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