USE OF INDENTATION TECHNIQUES FOR CHARACTERIZING WIRE BONDING MATERIALS

Donald Stone, S. Ruoff, W. LaFontaine, H. Wilson, Simo-Pekka Hannula, Che Yu Li

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Abstract

The determination of the mechanical properties of 25- mu m gold bonding wires based on low-load hardness measurements is reported. The experimental techniques are discussed. Measurements of yield strength made with Vickers and Berkovitch indenters were obtained that compared well with those reported from tensile tests on the same wires. Balls produced by electric arc at the ends of wires were found to have lower hardness than the as-received wires. Indentation load relaxation data taken from the balls are reported. The load relaxation data yield information on the flow stress of the material as a function of strain rate.
Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherIEEE
Pages318-323
Number of pages6
Publication statusPublished - 1986
MoE publication typeA4 Article in a conference publication
EventElectronic Components and Technology Conference - Seattle, WA, United States
Duration: 1 Jan 19861 Jan 1986
Conference number: 36

Publication series

NameProceedings - Electronic Components and Technology Conference
PublisherIEEE
ISSN (Print)0569-5503

Conference

ConferenceElectronic Components and Technology Conference
Country/TerritoryUnited States
CitySeattle, WA
Period01/01/198601/01/1986

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