Understanding Electromigration in Cu-CNT Composite Interconnects: A Multiscale Electrothermal Simulation Study

Research output: Contribution to journalArticleScientificpeer-review

Standard

Understanding Electromigration in Cu-CNT Composite Interconnects : A Multiscale Electrothermal Simulation Study. / Lee, Jaehyun; Berrada, Salim; Adamu-Lema, Fikru; Nagy, Nicole; Georgiev, Vihar P.; Sadi, Toufik; Liang, Jie; Ramos, Raphael; Carrillo-Nunez, Hamilton; Kalita, Dipankar; Lilienthal, Katharina; Wislicenus, Marcus; Pandey, Reeturaj; Chen, Bingan; Teo, Kenneth B.K.; Goncalves, Goncalo; Okuno, Hanako; Uhlig, Benjamin; Todri-Sanial, Aida; Dijon, Jean; Asenov, Asen.

In: IEEE Transactions on Electron Devices, Vol. 65, No. 9, 2018, p. 3884-3892.

Research output: Contribution to journalArticleScientificpeer-review

Harvard

Lee, J, Berrada, S, Adamu-Lema, F, Nagy, N, Georgiev, VP, Sadi, T, Liang, J, Ramos, R, Carrillo-Nunez, H, Kalita, D, Lilienthal, K, Wislicenus, M, Pandey, R, Chen, B, Teo, KBK, Goncalves, G, Okuno, H, Uhlig, B, Todri-Sanial, A, Dijon, J & Asenov, A 2018, 'Understanding Electromigration in Cu-CNT Composite Interconnects: A Multiscale Electrothermal Simulation Study' IEEE Transactions on Electron Devices, vol. 65, no. 9, pp. 3884-3892. https://doi.org/10.1109/TED.2018.2853550

APA

Vancouver

Author

Lee, Jaehyun ; Berrada, Salim ; Adamu-Lema, Fikru ; Nagy, Nicole ; Georgiev, Vihar P. ; Sadi, Toufik ; Liang, Jie ; Ramos, Raphael ; Carrillo-Nunez, Hamilton ; Kalita, Dipankar ; Lilienthal, Katharina ; Wislicenus, Marcus ; Pandey, Reeturaj ; Chen, Bingan ; Teo, Kenneth B.K. ; Goncalves, Goncalo ; Okuno, Hanako ; Uhlig, Benjamin ; Todri-Sanial, Aida ; Dijon, Jean ; Asenov, Asen. / Understanding Electromigration in Cu-CNT Composite Interconnects : A Multiscale Electrothermal Simulation Study. In: IEEE Transactions on Electron Devices. 2018 ; Vol. 65, No. 9. pp. 3884-3892.

Bibtex - Download

@article{7b53c8697273449ca7058e034ca60f82,
title = "Understanding Electromigration in Cu-CNT Composite Interconnects: A Multiscale Electrothermal Simulation Study",
abstract = "In this paper, we report a hierarchical simulation study of the electromigration (EM) problem in Cu-carbon nanotube (CNT) composite interconnects. This paper is based on the investigation of the activation energy and self-heating temperature using a multiscale electrothermal simulation framework. We first investigate the electrical and thermal properties of Cu-CNT composites, including contact resistances, using the density functional theory and reactive force field approaches, respectively. The corresponding results are employed in macroscopic electrothermal simulations taking into account the self-heating phenomenon. Our simulations show that although Cu atoms have similar activation energies in both bulk Cu and Cu-CNT composites, Cu-CNT composite interconnects are more resistant to EM thanks to the large Lorenz number of the CNTs. Moreover, we found that a large and homogenous conductivity along the transport direction in interconnects is one of the most important design rules to minimize the EM.",
keywords = "Conductivity, Contacts, Cu-carbon nanotubes (CNT) composites, density functional theory (DFT), Discrete Fourier transforms, Electromigration, electromigration (EM), electrothermal, interconnects, Lattices, multiscale simulation, Resistance, self-heating., Thermal conductivity",
author = "Jaehyun Lee and Salim Berrada and Fikru Adamu-Lema and Nicole Nagy and Georgiev, {Vihar P.} and Toufik Sadi and Jie Liang and Raphael Ramos and Hamilton Carrillo-Nunez and Dipankar Kalita and Katharina Lilienthal and Marcus Wislicenus and Reeturaj Pandey and Bingan Chen and Teo, {Kenneth B.K.} and Goncalo Goncalves and Hanako Okuno and Benjamin Uhlig and Aida Todri-Sanial and Jean Dijon and Asen Asenov",
year = "2018",
doi = "10.1109/TED.2018.2853550",
language = "English",
volume = "65",
pages = "3884--3892",
journal = "IEEE Transactions on Electron Devices",
issn = "0018-9383",
number = "9",

}

RIS - Download

TY - JOUR

T1 - Understanding Electromigration in Cu-CNT Composite Interconnects

T2 - A Multiscale Electrothermal Simulation Study

AU - Lee, Jaehyun

AU - Berrada, Salim

AU - Adamu-Lema, Fikru

AU - Nagy, Nicole

AU - Georgiev, Vihar P.

AU - Sadi, Toufik

AU - Liang, Jie

AU - Ramos, Raphael

AU - Carrillo-Nunez, Hamilton

AU - Kalita, Dipankar

AU - Lilienthal, Katharina

AU - Wislicenus, Marcus

AU - Pandey, Reeturaj

AU - Chen, Bingan

AU - Teo, Kenneth B.K.

AU - Goncalves, Goncalo

AU - Okuno, Hanako

AU - Uhlig, Benjamin

AU - Todri-Sanial, Aida

AU - Dijon, Jean

AU - Asenov, Asen

PY - 2018

Y1 - 2018

N2 - In this paper, we report a hierarchical simulation study of the electromigration (EM) problem in Cu-carbon nanotube (CNT) composite interconnects. This paper is based on the investigation of the activation energy and self-heating temperature using a multiscale electrothermal simulation framework. We first investigate the electrical and thermal properties of Cu-CNT composites, including contact resistances, using the density functional theory and reactive force field approaches, respectively. The corresponding results are employed in macroscopic electrothermal simulations taking into account the self-heating phenomenon. Our simulations show that although Cu atoms have similar activation energies in both bulk Cu and Cu-CNT composites, Cu-CNT composite interconnects are more resistant to EM thanks to the large Lorenz number of the CNTs. Moreover, we found that a large and homogenous conductivity along the transport direction in interconnects is one of the most important design rules to minimize the EM.

AB - In this paper, we report a hierarchical simulation study of the electromigration (EM) problem in Cu-carbon nanotube (CNT) composite interconnects. This paper is based on the investigation of the activation energy and self-heating temperature using a multiscale electrothermal simulation framework. We first investigate the electrical and thermal properties of Cu-CNT composites, including contact resistances, using the density functional theory and reactive force field approaches, respectively. The corresponding results are employed in macroscopic electrothermal simulations taking into account the self-heating phenomenon. Our simulations show that although Cu atoms have similar activation energies in both bulk Cu and Cu-CNT composites, Cu-CNT composite interconnects are more resistant to EM thanks to the large Lorenz number of the CNTs. Moreover, we found that a large and homogenous conductivity along the transport direction in interconnects is one of the most important design rules to minimize the EM.

KW - Conductivity

KW - Contacts

KW - Cu-carbon nanotubes (CNT) composites

KW - density functional theory (DFT)

KW - Discrete Fourier transforms

KW - Electromigration

KW - electromigration (EM)

KW - electrothermal

KW - interconnects

KW - Lattices

KW - multiscale simulation

KW - Resistance

KW - self-heating.

KW - Thermal conductivity

UR - http://www.scopus.com/inward/record.url?scp=85050408869&partnerID=8YFLogxK

U2 - 10.1109/TED.2018.2853550

DO - 10.1109/TED.2018.2853550

M3 - Article

VL - 65

SP - 3884

EP - 3892

JO - IEEE Transactions on Electron Devices

JF - IEEE Transactions on Electron Devices

SN - 0018-9383

IS - 9

ER -

ID: 27166847