Ultrasonic Study of Crack Under a Dynamic Thermal Load

Jorma Pitkänen, Mika Kemppainen

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Original languageEnglish
    Title of host publicationThe 30th Annual Quantitative Nondestructive Evaluation (QNDE) Conference, 28.7. - 1.8.2003, Wisconsin, USA
    Publication statusPublished - 2003
    MoE publication typeA4 Article in a conference publication


    • crack
    • nondestructive evaluation NDE
    • thermal fatigue

    Cite this