Ultrasonic Study of Crack Under a Dynamic Thermal Load

Jorma Pitkänen, Mika Kemppainen

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Original languageEnglish
    Title of host publicationThe 30th Annual Quantitative Nondestructive Evaluation (QNDE) Conference, 28.7. - 1.8.2003, Wisconsin, USA
    Pages5
    Publication statusPublished - 2003
    MoE publication typeA4 Article in a conference publication

    Keywords

    • crack
    • nondestructive evaluation NDE
    • thermal fatigue

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