Ultra-high on-chip optical gain in erbium-based hybrid slot waveguides

John Rönn*, Weiwei Zhang, Anton Autere, Xavier Leroux, Lasse Pakarinen, Carlos Alonso-Ramos, Antti Säynätjoki, Harri Lipsanen, Laurent Vivien, Eric Cassan, Zhipei Sun

*Corresponding author for this work

Research output: Contribution to journalArticleScientificpeer-review

152 Citations (Scopus)
362 Downloads (Pure)

Abstract

Efficient and reliable on-chip optical amplifiers and light sources would enable versatile integration of various active functionalities on the silicon platform. Although lasing on silicon has been demonstrated with semiconductors by using methods such as wafer bonding or molecular beam epitaxy, cost-effective mass production methods for CMOS-compatible active devices are still lacking. Here, we report ultra-high on-chip optical gain in erbium-based hybrid slot waveguides with a monolithic, CMOS-compatible and scalable atomic-layer deposition process. The unique layer-by-layer nature of atomic-layer deposition enables atomic scale engineering of the gain layer properties and straightforward integration with silicon integrated waveguides. We demonstrate up to 20.1 +/- 7.31 dB/cm and at least 52.4 +/- 13.8 dB/cm net modal and material gain per unit length, respectively, the highest performance achieved from erbium-based planar waveguides integrated on silicon. Our results show significant advances towards efficient on-chip amplification, opening a route to large-scale integration of various active functionalities on silicon.

Original languageEnglish
Article number432
Number of pages9
JournalNature Communications
Volume10
Issue number1
DOIs
Publication statusPublished - 25 Jan 2019
MoE publication typeA1 Journal article-refereed

Funding

The authors acknowledge the financial support from Aalto ELEC doctoral school, Aalto Centre for Quantum Engineering, Business Finland (FiDiPro: NP-Nano, A-Photonics and OPEC), Academy of Finland (grants: 276376, 284548, 295777, 304666, 312297, 312551, and 314810), Academy of Finland Flagship Programme (320167, PREIN), the European Union's Seventh Framework Program (REA grant agreement No. 631610), the European Union's Horizon 2020 research and innovation program (Grant agreement No. 820423, S2QUIP), ANR research agency (POSISLOT grant), and thank Micronova Nanofabrication Centre for providing the facilities. The authors also thank Dr. Lasse Karvonen and Dr. Antti Matikainen for useful discussions.

Keywords

  • SILICON
  • AMPLIFIERS
  • PHOTONICS
  • LASERS
  • STRIP
  • NM

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  • A-Photonics

    Sun, Z. (Principal investigator), Hedberg, D. (Project Member), Dai, Y. (Project Member), Kim, M. (Project Member), Rajamanickam, R. (Project Member), Kuen Yao, L. (Project Member), Pyymaki Perros, A. (Project Member) & Du, M. (Project Member)

    01/01/201931/12/2020

    Project: Business Finland: New business from research ideas (TUTLI)

  • S2QUIP: Scalable Two-Dimensional Quantum Integrated Photonics

    Sun, Z. (Principal investigator), Hu, X. (Project Member), Mohsen, A. (Project Member), Turunen, M. (Project Member), Yoon, H. H. (Project Member), Uddin, M. (Project Member), Wang, Y. (Project Member), Bai, X. (Project Member) & Du, M. (Project Member)

    01/10/201831/03/2022

    Project: EU: Framework programmes funding

  • LAYERED 2D MATERIALS BASED THZ SPECTROSCOPY AND IMAGING

    Sun, Z. (Principal investigator), Generalov, A. (Project Member), Uddin, M. (Project Member), Das, S. (Project Member), Mohsen, A. (Project Member) & Hulkko, E. (Project Member)

    01/01/201831/12/2021

    Project: Academy of Finland: Other research funding

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