Transfer printing of metallic microstructures on adhesion-promoting hydrogel substrates

Research output: Contribution to journalArticleScientificpeer-review


  • Haosheng Wu
  • Veikko Sariola
  • Congcong Zhu
  • Jingsi Zhao
  • Metin Sitti
  • Christopher J. Bettinger

Research units

  • Carnegie Mellon University
  • Max Planck Institute for Intelligent Systems
  • University of Pittsburgh


Fabrication schemes that integrate inorganic microstructures with hydrogel substrates are essential for advancing flexible electronics. A transfer printing process that is made possible through the design and synthesis of adhesion-promoting hydrogels as target substrates is reported. This fabrication technique may advance ultracompliant electronics by melding microfabricated structures with swollen hydrogel substrates.


Original languageEnglish
Pages (from-to)3398-3404
Number of pages7
JournalAdvanced Materials
Issue number22
Publication statusPublished - 1 Jun 2015
MoE publication typeA1 Journal article-refereed

    Research areas

  • adhesion, catechol, flexible electronics, hydrogels, transfer printing

ID: 9491764