Transfer printing of metallic microstructures on adhesion-promoting hydrogel substrates

Haosheng Wu, Veikko Sariola, Congcong Zhu, Jingsi Zhao, Metin Sitti, Christopher J. Bettinger*

*Corresponding author for this work

Research output: Contribution to journalArticleScientificpeer-review

48 Citations (Scopus)

Abstract

Fabrication schemes that integrate inorganic microstructures with hydrogel substrates are essential for advancing flexible electronics. A transfer printing process that is made possible through the design and synthesis of adhesion-promoting hydrogels as target substrates is reported. This fabrication technique may advance ultracompliant electronics by melding microfabricated structures with swollen hydrogel substrates.

Original languageEnglish
Pages (from-to)3398-3404
Number of pages7
JournalAdvanced Materials
Volume27
Issue number22
DOIs
Publication statusPublished - 1 Jun 2015
MoE publication typeA1 Journal article-refereed

Keywords

  • adhesion
  • catechol
  • flexible electronics
  • hydrogels
  • transfer printing

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