Towards Interoperability of Edge Datacentre in the Energy Community with IEC 61850 Modelling

Chen Wei Yang*, Nikolai Galkin*, Valeriy Vyatkin*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

Green modular datacentres are a new class of datacentres which can reduce the carbon footprints of the datacentre industry which accounts for close to 1% of total energy use worldwide. Green modular datacentres can operate as a prosumer and contribute energy to the energy grid through participation in the energy market as a part of the energy community. This paper investigates the interoperability of the datacentre in the energy community by proposing an IEC 61850 Logical Device model for a green modular datacentre. The applicability of the datacentre model is demonstrated through the re-implementation of the Energy Management System of an edge datacentre installation with the proposed IEC 61850 Logical Device model and its logical implementation in IEC 61499.

Original languageEnglish
Title of host publicationIECON 2023 - 49th Annual Conference of the IEEE Industrial Electronics Society
PublisherIEEE
Number of pages6
ISBN (Electronic)979-8-3503-3182-0
DOIs
Publication statusPublished - 2023
MoE publication typeA4 Conference publication
EventAnnual Conference of the IEEE Industrial Electronics Society - Singapore, Singapore, Singapore, Singapore
Duration: 16 Oct 202319 Oct 2023
Conference number: 49

Publication series

NameIECON Proceedings (Industrial Electronics Conference)
ISSN (Print)2162-4704
ISSN (Electronic)2577-1647

Conference

ConferenceAnnual Conference of the IEEE Industrial Electronics Society
Abbreviated titleIECON
Country/TerritorySingapore
CitySingapore
Period16/10/202319/10/2023

Keywords

  • Automation
  • Datacenter
  • Energy Community
  • IEC 61499
  • IEC 61850

Fingerprint

Dive into the research topics of 'Towards Interoperability of Edge Datacentre in the Energy Community with IEC 61850 Modelling'. Together they form a unique fingerprint.

Cite this