Toward comprehensive reliability assessment of electronic component boards by a combined loading approach

Toni Tuomas Mattila, Mervi Paulasto-Kröckel

Research output: Contribution to journalArticleScientificpeer-review

Original languageEnglish
Pages (from-to)1077-1091
JournalMicroelectronics Reliability
Volume51
Issue number6
Publication statusPublished - 2011
MoE publication typeA1 Journal article-refereed

Keywords

  • combined loading
  • concurrent loading
  • consecutive loading
  • drop
  • efficient reliability testing
  • failure modes and mechanisms
  • mixed loading
  • power cycling
  • reliability
  • shock
  • thermal cycling
  • vibration

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