Three dimensional hybrid microassembly combining robotic microhandling and selfassembly

Quan Zhou, Veikko Sariola, Bo Chang, Iiris Routa

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

Original languageEnglish
Title of host publication2011 IEEE International Conference on Robotics and Automation (ICRA 2011) - Workshop WS-M-1 - MEMS assembly and packaging: trends and challenges for robotics in the microscale, Shanghai, China, May 9-
Place of PublicationShanghai, China
PublisherIEEE
Pages7
Publication statusPublished - 2011
MoE publication typeB3 Non-refereed article in conference proceedings

Keywords

  • assembly
  • hybrid
  • microassembly
  • microrobotics
  • microsystem integration
  • self-assembly

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