Thermal Stress and Stress Induced Voiding in Passivated Narrow Line Metallizations

M.A. Korhonen, P. Borgesen, C.-Y. Li

Research output: Chapter in Book/Report/Conference proceeding › Chapter › Scientific › peer-review

Original language	English
Title of host publication	Thermal Stress and Strain in Microelectronics Packaging
Editors	J.H. Lau
Publisher	Van Nostrand Reinhold
Publication status	Published - 1992
MoE publication type	A3 Part of a book or another research book

Cite this

@inbook{ca22d97045124313ac2a5911418d1020,

title = "Thermal Stress and Stress Induced Voiding in Passivated Narrow Line Metallizations",

author = "M.A. Korhonen and P. Borgesen and C.-Y. Li",

year = "1992",

language = "English",

editor = "J.H. Lau",

booktitle = "Thermal Stress and Strain in Microelectronics Packaging",

publisher = "Van Nostrand Reinhold",

}