Thermal Stress and Stress Induced Voiding in Passivated Narrow Line Metallizations

M.A. Korhonen, P. Borgesen, C.-Y. Li

    Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

    Original languageEnglish
    Title of host publicationThermal Stress and Strain in Microelectronics Packaging
    EditorsJ.H. Lau
    PublisherVan Nostrand Reinhold
    Publication statusPublished - 1992
    MoE publication typeA3 Part of a book or another research book

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