Thermal-elasto-plastic analysis of W-Cu functionally graded materials subjected to a uniform heat flow by micromechanical model

M. Gasik, S. Ueda

    Research output: Contribution to journalArticleScientificpeer-review

    35 Citations (Scopus)
    Original languageEnglish
    Pages (from-to)395-409
    JournalJOURNAL OF THERMAL STRESSES
    Issue number23
    Publication statusPublished - 2000
    MoE publication typeA1 Journal article-refereed

    Keywords

    • functionally graded materials
    • heat flow
    • micromechanical
    • Thermal-elasto-plastic
    • W-Cu

    Cite this