Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections.Part 1: Effects of Test Parameters

Jussi Hokka, Toni T. Mattila, Hongbo Xu, Mervi Paulasto-Kröckel

Research output: Contribution to journalArticleScientificpeer-review

27 Citations (Scopus)
Original languageEnglish
Pages (from-to)1171-1183
JournalJournal of Electronic Materials
Volume42
Issue number6
Publication statusPublished - 2013
MoE publication typeA1 Journal article-refereed

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