Thermal Conductivity of Solidified Industrial Copper Matte and Fayalite Slag

David Sibarani, Joseph Hamuyuni*, Matti Luomala, Mari Lindgren, Ari Jokilaakso

*Corresponding author for this work

Research output: Contribution to journalArticleScientificpeer-review

1 Citation (Scopus)
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The thermal conductivity of various copper matte and fayalite slag was measured using laser flash analysis, a non-steady state measurement method. Industrial matte and slag samples were taken in such a way that their composition represented typical process conditions. Thermal conductivities for solid copper matte (average 64% Cu) were found to be from 1.2 W m−1 K−1 at 300°C to 2.1 W m−1 K−1 at 900°C. Because arsenic is one of the most important impurities in copper matte, its effect on thermal conductivity was investigated with As-doped matte samples up to 0.59% As. The results showed substantially lower thermal conductivity, between 0.5 W m−1 K−1 and 1.3 W m−1 K−1 at 300–900°C with low As matte, behavior that is analogous to that of a semiconductor. The data obtained showed that the thermal conductivity of copper matte increased linearly with temperature, but the gradient was small. The thermal conductivity of slags was found to be between 1.6 W m−1 K−1 and 1.9 W m−1 K−1, values that are consistent with earlier studies.

Original languageEnglish
Pages (from-to)1927–1934
Number of pages8
Issue number5
Early online date21 Feb 2020
Publication statusPublished - May 2020
MoE publication typeA1 Journal article-refereed


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