Thermal and plasma enhanced atomic layer deposition of SiO2 using commercial silicon precursors

Matti Putkonen; M. Bosund; Oili M. E. Ylivaara; Riikka Puurunen; L. Kilpi; H. Ronkainen; S. Sintonen; S. Ali; H. Lipsanen; Xuwen Liu; Eero Haimi; Simo-Pekka Hannula; Timo Sajavaara; I. Buchanan; E. Karwacki; Mika Vähä-Nissi

doi:10.1016/j.tsf.2014.02.087

Thermal and plasma enhanced atomic layer deposition of SiO2 using commercial silicon precursors

Matti Putkonen, M. Bosund, Oili M. E. Ylivaara, Riikka Puurunen, L. Kilpi, H. Ronkainen, S. Sintonen, S. Ali, H. Lipsanen, Xuwen Liu, Eero Haimi, Simo-Pekka Hannula, Timo Sajavaara, I. Buchanan, E. Karwacki, Mika Vähä-Nissi

Research output: Contribution to journal › Article › Scientific › peer-review

65 Citations (Scopus)

Original language	English
Pages (from-to)	93-98
Number of pages	6
Journal	Thin Solid Films
Volume	558
DOIs	https://doi.org/10.1016/j.tsf.2014.02.087
Publication status	Published - 2 May 2014
MoE publication type	A1 Journal article-refereed

Keywords

atomic layer deposition
batch deposition
conformal coating
plasma-enhanced atomic layer deposition
precursors
silicon dioxide

Access to Document

10.1016/j.tsf.2014.02.087

Cite this

Putkonen, M., Bosund, M., Ylivaara, O. M. E., Puurunen, R., Kilpi, L., Ronkainen, H., Sintonen, S., Ali, S., Lipsanen, H., Liu, X., Haimi, E., Hannula, S.-P., Sajavaara, T., Buchanan, I., Karwacki, E., & Vähä-Nissi, M. (2014). Thermal and plasma enhanced atomic layer deposition of SiO2 using commercial silicon precursors. Thin Solid Films, 558, 93-98. https://doi.org/10.1016/j.tsf.2014.02.087

@article{26a313541131475f87f352802cdc86b9,

title = "Thermal and plasma enhanced atomic layer deposition of SiO2 using commercial silicon precursors",

keywords = "atomic layer deposition, batch deposition, conformal coating, plasma-enhanced atomic layer deposition, precursors, silicon dioxide, atomic layer deposition, batch deposition, conformal coating, plasma-enhanced atomic layer deposition, precursors, silicon dioxide, atomic layer deposition, batch deposition, conformal coating, plasma-enhanced atomic layer deposition, precursors, silicon dioxide",

author = "Matti Putkonen and M. Bosund and Ylivaara, {Oili M. E.} and Riikka Puurunen and L. Kilpi and H. Ronkainen and S. Sintonen and S. Ali and H. Lipsanen and Xuwen Liu and Eero Haimi and Simo-Pekka Hannula and Timo Sajavaara and I. Buchanan and E. Karwacki and Mika V{\"a}h{\"a}-Nissi",

year = "2014",

month = may,

day = "2",

doi = "10.1016/j.tsf.2014.02.087",

language = "English",

volume = "558",

pages = "93--98",

journal = "Thin Solid Films",

issn = "0040-6090",

publisher = "Elsevier",

}

Putkonen, M, Bosund, M, Ylivaara, OME , Puurunen, R, Kilpi, L, Ronkainen, H, Sintonen, S, Ali, S, Lipsanen, H, Liu, X, Haimi, E, Hannula, S-P, Sajavaara, T, Buchanan, I, Karwacki, E & Vähä-Nissi, M 2014, 'Thermal and plasma enhanced atomic layer deposition of SiO2 using commercial silicon precursors', Thin Solid Films, vol. 558, pp. 93-98. https://doi.org/10.1016/j.tsf.2014.02.087

TY - JOUR

T1 - Thermal and plasma enhanced atomic layer deposition of SiO2 using commercial silicon precursors

AU - Putkonen, Matti

AU - Bosund, M.

AU - Ylivaara, Oili M. E.

AU - Puurunen, Riikka

AU - Kilpi, L.

AU - Ronkainen, H.

AU - Sintonen, S.

AU - Ali, S.

AU - Lipsanen, H.

AU - Liu, Xuwen

AU - Haimi, Eero

AU - Hannula, Simo-Pekka

AU - Sajavaara, Timo

AU - Buchanan, I.

AU - Karwacki, E.

AU - Vähä-Nissi, Mika

PY - 2014/5/2

Y1 - 2014/5/2

KW - atomic layer deposition

KW - batch deposition

KW - conformal coating

KW - plasma-enhanced atomic layer deposition

KW - precursors

KW - silicon dioxide

KW - atomic layer deposition

KW - batch deposition

KW - conformal coating

KW - plasma-enhanced atomic layer deposition

KW - precursors

KW - silicon dioxide

KW - atomic layer deposition

KW - batch deposition

KW - conformal coating

KW - plasma-enhanced atomic layer deposition

KW - precursors

KW - silicon dioxide

UR - http://dx.doi.org/10.1016/j.tsf.2014.02.087

U2 - 10.1016/j.tsf.2014.02.087

DO - 10.1016/j.tsf.2014.02.087

M3 - Article

SN - 0040-6090

VL - 558

SP - 93

EP - 98

JO - Thin Solid Films

JF - Thin Solid Films

ER -

Thermal and plasma enhanced atomic layer deposition of SiO2 using commercial silicon precursors

Keywords

Access to Document

Other files and links

OtaNano

Raw Materials Research Infrastructure

Cite this

Thermal and plasma enhanced atomic layer deposition of SiO2 using commercial silicon precursors

Keywords

Access to Document

Other files and links

Equipment

OtaNano

Raw Materials Research Infrastructure

Cite this