Thermal analysis of copper rod upcasting mold

K. Härkki, L. Holappa

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Original languageEnglish
    Title of host publication4th International Colloquim on Process Simulation, HUT, June 11-13, 1997
    Place of PublicationEspoo
    PublisherHUT, Department of Materials Science and Rock Engineering, Laboratory of Materials Processing and Powder Metallurgy
    Publication statusPublished - 1997
    MoE publication typeA4 Article in a conference publication


    • brass copper
    • continuous casting
    • heat transfer
    • mathematical modelling
    • solidification

    Cite this