The use of x-ray topography to map mechanical, thermomechanical and wire bond strain fields within packaged integrated circuits

P.J. McNally, J.W. Curley, T. Tuomi, R. Rantanmäki, A.N. Danilewsky

Research output: Working paper › Professional

Original language	English
Pages	710
Publication status	Published - 1997
MoE publication type	D4 Published development or research report or study

Name	Materials Research Society Fall Meeting, Boston, USA, December 1-5, 1997

Keywords

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title = "The use of x-ray topography to map mechanical, thermomechanical and wire bond strain fields within packaged integrated circuits",

keywords = "integrated circuits, x-ray topography, integrated circuits, x-ray topography, integrated circuits, x-ray topography",

author = "P.J. McNally and J.W. Curley and T. Tuomi and R. Rantanm{\"a}ki and A.N. Danilewsky",

year = "1997",

language = "English",

series = "Materials Research Society Fall Meeting, Boston, USA, December 1-5, 1997",

pages = "710",

type = "WorkingPaper",

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TY - UNPB

T1 - The use of x-ray topography to map mechanical, thermomechanical and wire bond strain fields within packaged integrated circuits

AU - McNally, P.J.

AU - Curley, J.W.

AU - Tuomi, T.

AU - Rantanmäki, R.

AU - Danilewsky, A.N.

PY - 1997

Y1 - 1997

KW - integrated circuits

KW - x-ray topography

KW - integrated circuits

KW - x-ray topography

KW - integrated circuits

KW - x-ray topography

M3 - Working paper

T3 - Materials Research Society Fall Meeting, Boston, USA, December 1-5, 1997

SP - 710

BT - The use of x-ray topography to map mechanical, thermomechanical and wire bond strain fields within packaged integrated circuits

ER -