The use of x-ray topography to map mechanical, thermomechanical and wire bond strain fields within packaged integrated circuits

P.J. McNally, J.W. Curley, T. Tuomi, R. Rantanmäki, A.N. Danilewsky

    Research output: Working paperProfessional

    Original languageEnglish
    Publication statusPublished - 1997
    MoE publication typeD4 Published development or research report or study

    Publication series

    NameMaterials Research Society Fall Meeting, Boston, USA, December 1-5, 1997


    • integrated circuits
    • x-ray topography

    Cite this