The use of x-ray topography to map mechanical, thermomechanical and wire-bond strain fields in packaged integrated circuits

P. McNally, J.W. Curley, T. Tuomi, R. Rantamäki, A.N. Danilewsky, P.A.F. Herbert

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Original languageEnglish
    Title of host publicationMaterials Research Socity Symposium
    Pages241-247
    Publication statusPublished - 1998
    MoE publication typeA4 Article in a conference publication

    Keywords

    • integrated circuits
    • topography
    • x-ray

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