The Role of Recrystallization in the Failure of SnAgCu Solder Interconnections Under Thermomechanical Loading

Toni Tuomas Mattila, Jorma Kalevi Kivilahti

    Research output: Contribution to journalArticleScientificpeer-review

    58 Citations (Scopus)
    Original languageEnglish
    Pages (from-to)629-635
    JournalIEEE Transactions on Components and Packaging Technologies
    Issue number3
    Publication statusPublished - 2010
    MoE publication typeA1 Journal article-refereed


    • Failure mechanism, Lead-free, recrystallization,
    • solder interconnections, thermal cycling

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