The Role of Recrystallization in the Failure of SnAgCu Solder Interconnections Under Thermomechanical Loading

Toni Tuomas Mattila; Jorma Kalevi Kivilahti

doi:10.1109/TCAPT.2010.2051268

The Role of Recrystallization in the Failure of SnAgCu Solder Interconnections Under Thermomechanical Loading

Toni Tuomas Mattila, Jorma Kalevi Kivilahti

Research output: Contribution to journal › Article › Scientific › peer-review

57 Citations (Scopus)

Original language	English
Pages (from-to)	629-635
Journal	IEEE Transactions on Components and Packaging Technologies
Volume	33
Issue number	3
DOIs	https://doi.org/10.1109/TCAPT.2010.2051268
Publication status	Published - 2010
MoE publication type	A1 Journal article-refereed

Keywords

Failure mechanism, Lead-free, recrystallization,
solder interconnections, thermal cycling

Access to Document

10.1109/TCAPT.2010.2051268

http://ieeexplore.ieee.org

Cite this

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title = "The Role of Recrystallization in the Failure of SnAgCu Solder Interconnections Under Thermomechanical Loading",

keywords = "Failure mechanism, Lead-free, recrystallization,, solder interconnections, thermal cycling, Failure mechanism, Lead-free, recrystallization,, solder interconnections, thermal cycling, Failure mechanism, Lead-free, recrystallization,, solder interconnections, thermal cycling",

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year = "2010",

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AU - Mattila, Toni Tuomas

AU - Kivilahti, Jorma Kalevi

PY - 2010

Y1 - 2010

KW - Failure mechanism, Lead-free, recrystallization,

KW - solder interconnections, thermal cycling

KW - Failure mechanism, Lead-free, recrystallization,

KW - solder interconnections, thermal cycling

KW - Failure mechanism, Lead-free, recrystallization,

KW - solder interconnections, thermal cycling

UR - http://ieeexplore.ieee.org

U2 - 10.1109/TCAPT.2010.2051268

DO - 10.1109/TCAPT.2010.2051268

M3 - Article

VL - 33

SP - 629

EP - 635

JO - IEEE Transactions on Components and Packaging Technologies

JF - IEEE Transactions on Components and Packaging Technologies

SN - 1521-3331

IS - 3

ER -