TY - JOUR
T1 - The Role of Recrystallization in the Failure of SnAgCu Solder Interconnections Under Thermomechanical Loading
AU - Mattila, Toni Tuomas
AU - Kivilahti, Jorma Kalevi
PY - 2010
Y1 - 2010
KW - Failure mechanism, Lead-free, recrystallization,
KW - solder interconnections, thermal cycling
KW - Failure mechanism, Lead-free, recrystallization,
KW - solder interconnections, thermal cycling
KW - Failure mechanism, Lead-free, recrystallization,
KW - solder interconnections, thermal cycling
UR - http://ieeexplore.ieee.org
U2 - 10.1109/TCAPT.2010.2051268
DO - 10.1109/TCAPT.2010.2051268
M3 - Article
VL - 33
SP - 629
EP - 635
JO - IEEE Transactions on Components and Packaging Technologies
JF - IEEE Transactions on Components and Packaging Technologies
SN - 1521-3331
IS - 3
ER -