The Role of Recrystallization in the Failure of SnAgCu Solder Interconnections Under Thermomechanical Loading

Toni Tuomas Mattila, Jorma Kalevi Kivilahti

    Research output: Contribution to journalArticleScientificpeer-review

    57 Citations (Scopus)
    Original languageEnglish
    Pages (from-to)629-635
    JournalIEEE Transactions on Components and Packaging Technologies
    Volume33
    Issue number3
    DOIs
    Publication statusPublished - 2010
    MoE publication typeA1 Journal article-refereed

    Keywords

    • Failure mechanism, Lead-free, recrystallization,
    • solder interconnections, thermal cycling

    Cite this