The Failure Mechanism of Recrystallization-Assisted Cracking of Solder Interconnection

Research output: Chapter in Book/Report/Conference proceeding › Chapter › Scientific › peer-review

1 Citation (Scopus)

Original language	English
Title of host publication	Recrystallization
Editors	K. Sztwiertnia
Place of Publication	Rijeka, Croatia
Publisher	InTech Open
Pages	179-206
ISBN (Electronic)	979-953-307-346-9
ISBN (Print)	978-953-51-0122-2
Publication status	Published - 2012
MoE publication type	A3 Book section, Chapters in research books

Cite this

@inbook{46d48b142b8d4580b3856719729ab3f7,

title = "The Failure Mechanism of Recrystallization-Assisted Cracking of Solder Interconnection",

author = "Mattila, \{Toni T.\} and Jorma Kivilahti",

year = "2012",

language = "English",

isbn = "978-953-51-0122-2",

pages = "179--206",

editor = "K. Sztwiertnia",

booktitle = "Recrystallization",

publisher = "InTech Open ",

address = "United Kingdom",

}

TY - CHAP

T1 - The Failure Mechanism of Recrystallization-Assisted Cracking of Solder Interconnection

AU - Mattila, Toni T.

AU - Kivilahti, Jorma

PY - 2012

Y1 - 2012

UR - http://www.intechopen.com/books/recrystallization/the-failure-mechanism-of-recrystallization-assisted-cracking-of-solder-interconnections

M3 - Chapter

SN - 978-953-51-0122-2

SP - 179

EP - 206

BT - Recrystallization

A2 - Sztwiertnia, K.

PB - InTech Open

CY - Rijeka, Croatia

ER -