The Failure Mechanism of Recrystallization-Assisted Cracking of Solder Interconnection

Toni T. Mattila, Jorma Kivilahti

    Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

    Original languageEnglish
    Title of host publicationRecrystallization
    EditorsK. Sztwiertnia
    Place of PublicationRijeka, Croatia
    PublisherInTech
    Pages179-206
    ISBN (Electronic)979-953-307-346-9
    ISBN (Print)978-953-51-0122-2
    Publication statusPublished - 2012
    MoE publication typeA3 Part of a book or another research book

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