The Effects of Concurrent Power and Vibration Loads on the Reliability of Board-Level Interconnections in Power Electronic Assemblies

Juha Karppinen, Jue Li, Mervi Paulasto-Kröckel

Research output: Contribution to journalArticleScientificpeer-review

17 Citations (Scopus)
Original languageEnglish
Pages (from-to)167-176
JournalIEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
Volume13
Issue number1
DOIs
Publication statusPublished - 2013
MoE publication typeA1 Journal article-refereed

Keywords

  • Concurrent test
  • lead free
  • power cycling
  • reliability
  • solder interconnection
  • vibration testing

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