Testing and multi-scale modeling of drop and impact loading of complex MEMS microphone assemblies

Jingshi Meng, Toni T. Mattila, Abhijit Dasgupta, Markku Sillanpää, Reino Jaakkola, Klas Anderson, Esa Hussa

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    14 Citations (Scopus)
    Original languageEnglish
    Title of host publication13th Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanoelectronics and Systems (EuroSimE), Lisbon, Portugal, April 16-17-18, 2012
    Pages1-8
    Publication statusPublished - 2012
    MoE publication typeA4 Article in a conference publication

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