@techreport{5424e33f1ab34ce991dc2eb61c43c627,
title = "Tantalum-based diffusion barriers for copper metallization",
keywords = "copper, diffusion barrier, tantalum, thermodynamics, copper, diffusion barrier, tantalum, thermodynamics, copper, diffusion barrier, tantalum, thermodynamics",
author = "T. Laurila and K. Zeng and J. Kivilahti",
year = "1999",
language = "English",
series = "Report series HUT-EPT",
publisher = "Teknillinen korkeakoulu",
number = "1",
address = "Finland",
type = "WorkingPaper",
institution = "Teknillinen korkeakoulu",
}