Tantalum-based diffusion barriers for copper metallization

T. Laurila, K. Zeng, J. Kivilahti

    Research output: Working paperProfessional

    Original languageEnglish
    PublisherTeknillinen korkeakoulu
    Number of pages37
    Publication statusPublished - 1999
    MoE publication typeD4 Published development or research report or study

    Publication series

    NameReport series HUT-EPT
    No.1

    Keywords

    • copper
    • diffusion barrier
    • tantalum
    • thermodynamics

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