Synchrotron X-raytopographic study of strain in silicon wafers with integrated circuits

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Original languageEnglish
Pages (from-to)181-184
JournalIl Nuovo Cimento
Volume19 D
Issue number1
Publication statusPublished - 1997
MoE publication typeA1 Journal article-refereed

    Research areas

  • strain in silicon

ID: 4855555