Synchrotron X-ray topographic study of strain in silicon wafers with integrated circuits

Research output: Contribution to journalArticle

Researchers

Research units

  • Dublin City University

Details

Original languageEnglish
Pages (from-to)181-184
Number of pages4
JournalIl Nuovo Cimento
Volume19
Issue number2
Publication statusPublished - Feb 1997
MoE publication typeA1 Journal article-refereed

    Research areas

  • silicon wafers, synchrotron, topographic study

ID: 4890758