Synchrotron X-ray topographic study of strain in silicon wafers with integrated circuits

Research output: Working paperProfessional

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Details

Original languageEnglish
Place of PublicationPalermo, Italy
Pages132
Publication statusPublished - 1996
MoE publication typeD4 Published development or research report or study

Publication series

Name3rd European Symposium on X-ray topography and high resolution diffraction (X-TOP'96), Palermo, Italy, 22-24 April 1996

    Research areas

  • optoelectronics, semiconductors

ID: 5177308