Synchrotron X-ray topographic study of strain in silicon wafers with integrated circuits

M. Karilahti, T. Tuomi, M. Taskinen, J. Tulkki, H. Lipsanen, P. McNally

    Research output: Contribution to journalArticleScientificpeer-review

    7 Citations (Scopus)
    Original languageEnglish
    Pages (from-to)181-184
    Number of pages4
    JournalIl Nuovo Cimento
    Volume19
    Issue number2
    DOIs
    Publication statusPublished - Feb 1997
    MoE publication typeA1 Journal article-refereed

    Keywords

    • silicon wafers
    • synchrotron
    • topographic study

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