Synchrotron X-ray topographic studies of strain in silicon wafers with integrated circuits.

T. Tuomi, M. Karilahti, P. Äyräs, H. Lipsanen, P. McNally

    Research output: Working paperProfessional

    Original languageEnglish
    Place of PublicationGermany
    Publication statusPublished - 1995
    MoE publication typeD4 Published development or research report or study


    • synchrotron X-ray topography, semiconductors

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