Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding

Joseph Hotchkiss; Vesa Vuorinen; Hongqun Dong; Glenn Ross; Jani Kaaos; Mervi Paulasto-Krockel; Tobias Wernicke; Anneliese Ponninger

doi:10.1109/ESTC48849.2020.9229696

Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding

Joseph Hotchkiss
, Vesa Vuorinen
, Hongqun Dong
, Glenn Ross
, Jani Kaaos
, Mervi Paulasto-Krockel
, Tobias Wernicke
, Anneliese Ponninger

EV Group E. Thallner GmbH

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

8 Citations (Scopus)

288 Downloads (Pure)

Abstract

The Solid Liquid Interdiffusion (SLID) bonds carried out for this work take advantage of the Cu-In-Sn ternary system to achieve low temperature wafer-level bonds. The experiments were carried out across a range of temperatures and the results cover optimized wafer-level bonding process, the formation of the bond microstructure, mechanical performance, as well as the effects of thermal aging.

Original language	English
Title of host publication	Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020
Publisher	IEEE
Number of pages	5
ISBN (Electronic)	9781728162928
DOIs	https://doi.org/10.1109/ESTC48849.2020.9229696
Publication status	Published - 15 Sept 2020
MoE publication type	A4 Conference publication
Event	Electronics System-Integration Technology Conference - Virtual conference, Tonsberg, Vestfold, Norway Duration: 15 Sept 2020 → 18 Sept 2020 Conference number: 8

Conference

Conference	Electronics System-Integration Technology Conference
Abbreviated title	ESTC
Country/Territory	Norway
City	Tonsberg, Vestfold
Period	15/09/2020 → 18/09/2020
Other	Virtual conference

Funding

This project has received funding from the ECSEL Joint Undertaking (JU) under grant agreement No 826588. The JU receives support from the European Union’s Horizon 2020 research and innovation programme and Belgium, Germany, Netherlands, Finland, Austria, France, Hungary, Latvia, Norway, Switzerland, Israel. The authors would also like to acknowledge the Innovation Funding Agency Business Finland (formerly Tekes) for financial support. The authors acknowledge the provision of facilities as well as technical support by Aalto University at OtaNano - Nanomicroscopy Center (Aalto-NMC). The Authors would like to acknowledge Okmetic for the Si wafers and to OtaNano for therpvisoionfoc ilitiefsanadtechnical support.

Keywords

Copper
Indium
Tin

Access to Document

10.1109/ESTC48849.2020.9229696

ELEC_Hotchkiss_etal_Study-of-Cu-Sn-In_ESTC2020_acceptedauthormanuscriptAccepted author manuscript, 20.3 MB

Cite this

Hotchkiss, J., Vuorinen, V., Dong, H., Ross, G., Kaaos, J., Paulasto-Krockel, M., Wernicke, T., & Ponninger, A. (2020). Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding. In Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020 Article 9229696 IEEE. https://doi.org/10.1109/ESTC48849.2020.9229696

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title = "Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding",

abstract = "The Solid Liquid Interdiffusion (SLID) bonds carried out for this work take advantage of the Cu-In-Sn ternary system to achieve low temperature wafer-level bonds. The experiments were carried out across a range of temperatures and the results cover optimized wafer-level bonding process, the formation of the bond microstructure, mechanical performance, as well as the effects of thermal aging.",

keywords = "Copper, Indium, Tin",

author = "Joseph Hotchkiss and Vesa Vuorinen and Hongqun Dong and Glenn Ross and Jani Kaaos and Mervi Paulasto-Krockel and Tobias Wernicke and Anneliese Ponninger",

note = "| openaire: EC/H2020/826588/EU//APPLAUSE; Electronics System-Integration Technology Conference, ESTC ; Conference date: 15-09-2020 Through 18-09-2020",

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Hotchkiss, J, Vuorinen, V, Dong, H, Ross, G, Kaaos, J, Paulasto-Krockel, M, Wernicke, T & Ponninger, A 2020, Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding. in Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020., 9229696, IEEE, Electronics System-Integration Technology Conference, Tonsberg, Vestfold, Norway, 15/09/2020. https://doi.org/10.1109/ESTC48849.2020.9229696

Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding. / Hotchkiss, Joseph; Vuorinen, Vesa; Dong, Hongqun et al.
Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020. IEEE, 2020. 9229696.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

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AU - Hotchkiss, Joseph

AU - Vuorinen, Vesa

AU - Dong, Hongqun

AU - Ross, Glenn

AU - Kaaos, Jani

AU - Paulasto-Krockel, Mervi

AU - Wernicke, Tobias

AU - Ponninger, Anneliese

N1 - Conference code: 8

PY - 2020/9/15

Y1 - 2020/9/15

N2 - The Solid Liquid Interdiffusion (SLID) bonds carried out for this work take advantage of the Cu-In-Sn ternary system to achieve low temperature wafer-level bonds. The experiments were carried out across a range of temperatures and the results cover optimized wafer-level bonding process, the formation of the bond microstructure, mechanical performance, as well as the effects of thermal aging.

AB - The Solid Liquid Interdiffusion (SLID) bonds carried out for this work take advantage of the Cu-In-Sn ternary system to achieve low temperature wafer-level bonds. The experiments were carried out across a range of temperatures and the results cover optimized wafer-level bonding process, the formation of the bond microstructure, mechanical performance, as well as the effects of thermal aging.

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KW - Indium

KW - Tin

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ER -

Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding

Abstract

Conference

Funding

Keywords

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APPLAUSE: Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe

OtaNano

OtaNano - Nanomicroscopy Center

Cite this

Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding

Abstract

Conference

Funding

Keywords

Access to Document

Other files and links

Fingerprint

Projects

APPLAUSE: Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe

Equipment

OtaNano

OtaNano - Nanomicroscopy Center

Cite this