Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding

Joseph Hotchkiss, Vesa Vuorinen, Hongqun Dong, Glenn Ross, Jani Kaaos, Mervi Paulasto-Krockel, Tobias Wernicke, Anneliese Ponninger

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

2 Citations (Scopus)
178 Downloads (Pure)


The Solid Liquid Interdiffusion (SLID) bonds carried out for this work take advantage of the Cu-In-Sn ternary system to achieve low temperature wafer-level bonds. The experiments were carried out across a range of temperatures and the results cover optimized wafer-level bonding process, the formation of the bond microstructure, mechanical performance, as well as the effects of thermal aging.

Original languageEnglish
Title of host publicationProceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020
Number of pages5
ISBN (Electronic)9781728162928
Publication statusPublished - 15 Sep 2020
MoE publication typeA4 Article in a conference publication
EventElectronics System-Integration Technology Conference - Virtual conference, Tonsberg, Vestfold, Norway
Duration: 15 Sep 202018 Sep 2020
Conference number: 8


ConferenceElectronics System-Integration Technology Conference
Abbreviated titleESTC
CityTonsberg, Vestfold
OtherVirtual conference


  • Copper
  • Indium
  • Tin


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