Projects per year
The Solid Liquid Interdiffusion (SLID) bonds carried out for this work take advantage of the Cu-In-Sn ternary system to achieve low temperature wafer-level bonds. The experiments were carried out across a range of temperatures and the results cover optimized wafer-level bonding process, the formation of the bond microstructure, mechanical performance, as well as the effects of thermal aging.
|Title of host publication||Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020|
|Number of pages||5|
|Publication status||Published - 15 Sep 2020|
|MoE publication type||A4 Article in a conference publication|
|Event||Electronics System-Integration Technology Conference - Virtual conference, Tonsberg, Vestfold, Norway|
Duration: 15 Sep 2020 → 18 Sep 2020
Conference number: 8
|Conference||Electronics System-Integration Technology Conference|
|Period||15/09/2020 → 18/09/2020|
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- 1 Finished
APPLAUSE: Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe
Paulasto-Kröckel, M., Emadi, F., Nieminen, T., Ross, G., Tiwary, N., Golim, O. & Vuorinen, V.
01/05/2019 → 31/10/2022
Project: Business Finland: Other research funding
Anna Rissanen (Manager)Aalto University
OtaNano - Nanomicroscopy Center
Jani Seitsonen (Manager)OtaNano