Strain Relief in Cu-Pd Heteroepitaxy

Yafeng Lu, M. Przybylski, O. Trushin, W.H. Wang, J. Barthel, E. Granato, S.J. Ying, T. Ala-Nissila

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Abstract

We present experimental and theoretical studies of Pd/Cu(100) and Cu/Pd(100) heterostructures in order to explore their structure and misfit strain relaxation. Ultrathin Pd and Cu films are grown by pulsed laser deposition at room temperature. For Pd/Cu, compressive strain is released by networks of misfit dislocations running in the [100] and [010] directions, which appear after a few monolayers (ML) already. In striking contrast, for Cu/Pd the tensile overlayer remains coherent up to about 9 ML, after which multilayer growth occurs. The strong asymmetry between tensile and compressive cases is in contradiction with continuum elasticity theory and is also evident in the structural parameters of the strained films. Molecular dynamics calculations based on classical many-body potentials confirm the pronounced tensile-compressive asymmetry and are in good agreement with the experimental data.
Original languageEnglish
Article number146105
Pages (from-to)1-4
JournalPhysical Review Letters
Volume94
Issue number14
DOIs
Publication statusPublished - 2005
MoE publication typeA1 Journal article-refereed

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    Lu, Y., Przybylski, M., Trushin, O., Wang, W. H., Barthel, J., Granato, E., Ying, S. J., & Ala-Nissila, T. (2005). Strain Relief in Cu-Pd Heteroepitaxy. Physical Review Letters, 94(14), 1-4. [146105]. https://doi.org/10.1103/PhysRevLett.94.146105