Solid-state reactions between Cu(Ni) alloys and Sn

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Abstract

Solid-state interfacial reactions between Sn and Cu(Ni) alloys have been investigated at the temperature of 125°C. The following results were obtained. Firstly, the addition of 0.1 at.% Ni to Cu decreased the total thickness of the intermetallic compound (IMC) layer to about half of that observed in the binary Cu/Sn diffusion couple; the Ni addition decreased especially the thickness of Cu 3Sn. Secondly, the addition of 1 to 2.5 at.% Ni to Cu further decreased the thickness of Cu 3Sn, increased that of Cu 6Sn 5 (compared to that in the binary Cu/Sn couple) and produced significant amount of voids at the Cu/Cu 3Sn interface. Thirdly, the addition of 5 at.% Ni to Cu increased the total thickness of the IMC layer to about two times that observed in the binary Cu/Sn diffusion couple and made the Cu 3Sn disappear. Fourthly, in contrast to the previous case, the addition of 10 at.% Ni to Cu decreased the total IMC (Cu 6Sn 5) thickness again close to that of the Cu/Sn couple. With this Ni content no voids were detected. The results are rationalized with the help of the thermodynamics of the Sn-Cu-Ni system as well as with kinetic considerations.

Details

Original languageEnglish
Pages (from-to)1355-1362
Number of pages8
JournalJournal of Electronic Materials
Volume36
Issue number10
Publication statusPublished - Oct 2007
MoE publication typeA1 Journal article-refereed

    Research areas

  • Intermetallic reactions, Kinetics, Kirkendall voids, Sn-Cu-Ni system, Thermodynamics

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