Solid-state reaction of electroplated thin film Au/Sn couple at low temperatures

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Original languageEnglish
Pages (from-to)325331
JournalJournal of Alloys and Compounds
Volume619
Issue numberjanuary 15
Publication statusPublished - 2015
MoE publication typeA1 Journal article-refereed

    Research areas

  • Interfacial reaction, Intermetallic compound (IMC), MEMS, SLID

ID: 2040399