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Solidification Analysis Package for Binary Fcc Copper Alloys, DOS-version 2.0.0

  • Jyrki Miettinen

    Research output: Artistic and non-textual form › Software › Scientific

    Original languageEnglish
    Publication statusPublished - 2001
    MoE publication typeI2 ICT applications

    Keywords

    • copper
    • copper alloys
    • solidification

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