Solidification Analysis Package for Binary Fcc Copper Alloys, DOS-version 2.0.0

Jyrki Miettinen

    Research output: Artistic and non-textual formSoftwareScientific

    Original languageEnglish
    Publication statusPublished - 2001
    MoE publication typeI2 ICT applications

    Keywords

    • copper
    • copper alloys
    • solidification

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