@article{c4033520ae40498bb0619b2fc23acef6,
title = "Solid-state reaction of electroplated thin film Au/Sn couple at low temperatures",
keywords = "Interfacial reaction, Intermetallic compound (IMC), MEMS, SLID, Interfacial reaction, Intermetallic compound (IMC), MEMS, SLID, Interfacial reaction, Intermetallic compound (IMC), MEMS, SLID",
author = "Hongbo Xu and Vesa Vuorinen and Hongqun Dong and Mervi Paulasto-Kr{\"o}ckel",
year = "2015",
doi = "10.1016/j.jallcom.2014.08.245",
language = "English",
volume = "619",
pages = "325331",
journal = "Journal of Alloys and Compounds",
issn = "0925-8388",
publisher = "Elsevier",
number = "january 15",
}