Solid-state reaction of electroplated thin film Au/Sn couple at low temperatures

Hongbo Xu, Vesa Vuorinen, Hongqun Dong, Mervi Paulasto-Kröckel

Research output: Contribution to journalArticleScientificpeer-review

Original languageEnglish
Pages (from-to)325331
JournalJournal of Alloys and Compounds
Volume619
Issue numberjanuary 15
DOIs
Publication statusPublished - 2015
MoE publication typeA1 Journal article-refereed

Keywords

  • Interfacial reaction
  • Intermetallic compound (IMC)
  • MEMS
  • SLID

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