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Solid-liquid interdiffusion bonding for MEMS device integration
Antti Rautiainen
Department of Electrical Engineering and Automation
Research output
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Thesis
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Doctoral Thesis
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Dive into the research topics of 'Solid-liquid interdiffusion bonding for MEMS device integration'. Together they form a unique fingerprint.
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Engineering
Integration
100%
Interdiffusion
100%
Microelectromechanical System
100%
Copper
50%
Metallizations
37%
Applications
25%
Performance
25%
Reliability
25%
Aluminum
25%
High Temperature
25%
Thermodynamic Data
25%
Aluminum Alloys
25%
Device Performance
25%
Design
12%
Environment
12%
Combines
12%
Alloy
12%
Intermetallics
12%
Tensile Test
12%
Room Temperature
12%
Kinetic
12%
Layer Thickness
12%
Thermal Energy Storage
12%
Material System
12%
Thermodynamics
12%
High Strength
12%
Simplifies
12%
Structural Reliability
12%
Interconnection
12%
Integrated Circuit
12%
Melting Temperature
12%
Base Metal
12%
Crystal Structure
12%
Automotives
12%
Systems (Metallurgical)
12%
Process Integration
12%
Reliability Evaluation
12%
Electronics Industry
12%
Wafer Bonding
12%
Critical System
12%
Material Science
Solid
100%
Liquid
100%
Platinum
75%
Temperature
62%
Devices
50%
Tin
50%
Metal
37%
Metallization
37%
Mechanical Strength
25%
Electronic Circuit
12%
Electronics
12%
Material
12%
Alloy
12%
Intermetallics
12%
Thermal Shock
12%
Gas
12%
Glass
12%
Crystal Structure
12%
Electroplating
12%
Microstructural Analysis
12%