Solder/Substrate Interfacial Reactions in Sn-Cu-Ni Interconnection System

Hao Yu, Vesa Vuorinen, Jorma Kivilahti

    Research output: Contribution to journalArticleScientificpeer-review

    34 Citations (Scopus)
    Original languageEnglish
    Pages (from-to)136-146
    JournalJournal of Electronic Materials
    Volume36
    Issue number2
    Publication statusPublished - 2007
    MoE publication typeA1 Journal article-refereed

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