@inproceedings{491ceca6d75e478b84ee1df022775998,
title = "Solderless Interconnection and Packaging Technique for Embedded Active Components",
keywords = "active components, chips first, embedded, high density interconnection, solderless, active components, chips first, embedded, high density interconnection, solderless, active components, chips first, embedded, high density interconnection, solderless",
author = "A. Kujala and R. Tuominen and J. Kivilahti",
year = "1999",
language = "English",
pages = "155--160",
booktitle = "The 1999 IEEE/EIA CPMT Electronic Component Technology Conference, San Diefo Califronia USA, 1.-4. June 1999",
}