Solderless Interconnection and Packaging Technique for Embedded Active Components

A. Kujala, R. Tuominen, J. Kivilahti

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    26 Citations (Scopus)
    Original languageEnglish
    Title of host publicationThe 1999 IEEE/EIA CPMT Electronic Component Technology Conference, San Diefo Califronia USA, 1.-4. June 1999
    Pages155-160
    Publication statusPublished - 1999
    MoE publication typeA4 Article in a conference publication

    Keywords

    • active components
    • chips first
    • embedded
    • high density interconnection
    • solderless

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