Simulation of solidification and calculation of thermophysical properties for binary copper alloys

Jyrki Miettinen

    Research output: Working paperProfessional

    Original languageEnglish
    Place of PublicationHelsinki
    Pages120
    Publication statusPublished - 2004
    MoE publication typeD4 Published development or research report or study

    Publication series

    NameTeknillisen korkeakoulun materiaalitekniikan ja metallurgian julkaisuja
    PublisherTeknillinen korkeakoulu
    No.TKK-MK-161

    Keywords

    • copper alloys
    • diffusion
    • material properties
    • microstructure
    • solidification
    • thermodynamics

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