Simulation of dynamic recrystallization in solder interconnections during thermal cycling

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Original languageEnglish
Pages (from-to)690-697
JournalComputational Materials Science
Volume50
Issue number2
Publication statusPublished - 2010
MoE publication typeA1 Journal article-refereed

    Research areas

  • Dynamic recrystallization, Finite element method, Lead-free solder, Monte Carlo method, Reliability

ID: 941107