@article{b3341b713df1431db0b1929f617ee7a0,
title = "Simulation of dynamic recrystallization in solder interconnections during thermal cycling",
keywords = "Dynamic recrystallization, Finite element method, Lead-free solder, Monte Carlo method, Reliability, Dynamic recrystallization, Finite element method, Lead-free solder, Monte Carlo method, Reliability, Dynamic recrystallization, Finite element method, Lead-free solder, Monte Carlo method, Reliability",
author = "J. Li and H. Xu and T.T. Mattila and Kivilahti, \{J. K.\} and T. Laurila and M. Paulasto-Kr{\"o}ckel",
year = "2010",
doi = "10.1016/j.commatsci.2010.09.035",
language = "English",
volume = "50",
pages = "690--697",
journal = "Computational Materials Science",
issn = "0927-0256",
publisher = "Elsevier",
number = "2",
}