Simulation of dynamic recrystallization in solder interconnections during thermal cycling

J. Li, H. Xu, T.T. Mattila, J. K. Kivilahti, T. Laurila, M. Paulasto-Kröckel

Research output: Contribution to journalArticleScientificpeer-review

25 Citations (Scopus)
Original languageEnglish
Pages (from-to)690-697
JournalComputational Materials Science
Issue number2
Publication statusPublished - 2010
MoE publication typeA1 Journal article-refereed


  • Dynamic recrystallization
  • Finite element method
  • Lead-free solder
  • Monte Carlo method
  • Reliability

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