SAW Device Analysis Using a Combination of FEM/BEM Calculations and Scanning Interferometer Measurements

S. Chamaly; R. Lardat; T. Pastureaud; P. Dufilie; W. Steichen; O. Holmgren; M. Kuitunen; J.V. Knuuttila; M.M. Salomaa

SAW Device Analysis Using a Combination of FEM/BEM Calculations and Scanning Interferometer Measurements

S. Chamaly, R. Lardat, T. Pastureaud, P. Dufilie, W. Steichen, O. Holmgren, M. Kuitunen, J.V. Knuuttila, M.M. Salomaa

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

4 Citations (Scopus)

Original language	English
Title of host publication	2003 IEEE Ultrasonics Symposium, Hawaiji lokakuu 2003
Pages	294
Publication status	Published - 2003
MoE publication type	A4 Article in a conference publication

Cite this

@inproceedings{1381f93b3ab445058c6f565fe54b48af,

title = "SAW Device Analysis Using a Combination of FEM/BEM Calculations and Scanning Interferometer Measurements",

author = "S. Chamaly and R. Lardat and T. Pastureaud and P. Dufilie and W. Steichen and O. Holmgren and M. Kuitunen and J.V. Knuuttila and M.M. Salomaa",

year = "2003",

language = "English",

pages = "294",

booktitle = "2003 IEEE Ultrasonics Symposium, Hawaiji lokakuu 2003",

}

SAW Device Analysis Using a Combination of FEM/BEM Calculations and Scanning Interferometer Measurements. / Chamaly, S.; Lardat, R.; Pastureaud, T.; Dufilie, P.; Steichen, W.; Holmgren, O.; Kuitunen, M.; Knuuttila, J.V.; Salomaa, M.M.

2003 IEEE Ultrasonics Symposium, Hawaiji lokakuu 2003. 2003. p. 294.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - SAW Device Analysis Using a Combination of FEM/BEM Calculations and Scanning Interferometer Measurements

AU - Chamaly, S.

AU - Lardat, R.

AU - Pastureaud, T.

AU - Dufilie, P.

AU - Steichen, W.

AU - Holmgren, O.

AU - Kuitunen, M.

AU - Knuuttila, J.V.

AU - Salomaa, M.M.

PY - 2003

Y1 - 2003

M3 - Conference contribution

SP - 294

BT - 2003 IEEE Ultrasonics Symposium, Hawaiji lokakuu 2003

ER -