Rotational grinding of silicon wafers - sub-surface damage inspection

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Rotational grinding of silicon wafers - sub-surface damage inspection. / Haapalinna, A.; Nevas, S.; Pähler, D.

In: Materials Science and Engineering B: Advanced Functional Solid-State Materials, 2004, p. 321-331.

Research output: Contribution to journalArticleScientificpeer-review

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@article{8049382872454862bfa2eb2467201446,
title = "Rotational grinding of silicon wafers - sub-surface damage inspection",
keywords = "measurement method, rotational grinding, silicon wafer, sub-surface damage, measurement method, rotational grinding, silicon wafer, sub-surface damage, measurement method, rotational grinding, silicon wafer, sub-surface damage",
author = "A. Haapalinna and S. Nevas and D. P{\"a}hler",
year = "2004",
language = "English",
pages = "321--331",
journal = "MATERIALS SCIENCE AND ENGINEERING B: ADVANCED FUNCTIONAL SOLID-STATE MATERIALS",
issn = "1873-4944",
publisher = "Elsevier BV",

}

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TY - JOUR

T1 - Rotational grinding of silicon wafers - sub-surface damage inspection

AU - Haapalinna, A.

AU - Nevas, S.

AU - Pähler, D.

PY - 2004

Y1 - 2004

KW - measurement method

KW - rotational grinding

KW - silicon wafer

KW - sub-surface damage

KW - measurement method

KW - rotational grinding

KW - silicon wafer

KW - sub-surface damage

KW - measurement method

KW - rotational grinding

KW - silicon wafer

KW - sub-surface damage

M3 - Article

SP - 321

EP - 331

JO - MATERIALS SCIENCE AND ENGINEERING B: ADVANCED FUNCTIONAL SOLID-STATE MATERIALS

JF - MATERIALS SCIENCE AND ENGINEERING B: ADVANCED FUNCTIONAL SOLID-STATE MATERIALS

SN - 1873-4944

ER -

ID: 3573763