Rotational grinding of silicon wafers - sub-surface damage inspection

Research output: Contribution to journalArticle


  • A. Haapalinna
  • S. Nevas
  • D. Pähler

Research units


Original languageEnglish
Pages (from-to)321-331
JournalMaterials Science and Engineering B: Advanced Functional Solid-State Materials
Publication statusPublished - 2004
MoE publication typeA1 Journal article-refereed

    Research areas

  • measurement method, rotational grinding, silicon wafer, sub-surface damage

ID: 3573763